集成电路版图

① 什么是集成电路版图设计

就是按照晶体管级电路图设计集成电路的工艺图层，每一层代表一种使用的材料，比如多专晶硅，有源区，金属属1，金属2等等。
个人认为这和机械上的机械制图很相似，工厂都是按照这种图加工产品的；只不过机械厂造出来的是机器，集成电路生产厂家通过各种工艺（光刻，刻蚀，离子注入），按照版图生产集成电路。
现在纯手工不借助子电路版图库画版图的情况已经比较少了。有问题欢迎继续问我，我是超大规模集成电路方向的研究生

② 集成电路版图的全自动布局布线

加分我告诉你

先给你一个目录吧 english

Synthesis, Place & Route
Ketan Joshi
Director of Marketing, SP&R
Design Concept to Implementation
Design Implementation Plan
Proctive Design Plan with Cadence SP&R
Proctive Design Plan with Cadence SP&R
Proctive Design Plan with Cadence SP&R
Ambit BuildGates Quick Reference Card
What is it?
A logic synthesis tool
Like conventional synthesis, with greater performance and capacity
Who is the Typical User?
Logic designers using ASIC or COT flows
Why is it Better?
Higher performance/capacity
Superior QoR
Integrated Static Timing sign-off
Integrated Chip Synthesis and STA
Ambit BuildGates: Comprehensive Synthesis
Verilog, VHDL, EDIF
Integrated, Sign-off timing engine
Time Budgeting
Graphical UI
Distributed synthesis
AmbitWare
Test Synthesis
TCL - user interface
SDF,GCF, PDEF
Sun, HP, IBM
Business StatisticsConventional Synthesis
Over 500 customers
More than 3000 active licenses worldwide
Leading ASIC vendor support
AMI, Atmel, Chip Express, Faraday Technology, Fujitsu, IBM, Kawasaki Steel, LSI, Lucent, Matsushita, Mitsubishi, NEC, OKI, Toshiba, VLSI
Proctive Design Plan with Cadence SP&R
Low Power Synthesis OptionQuick Reference Card
What is it?
An option to Ambit BuildGates and PKS
Enables less power consuming design
Who is the Typical User?
Logic designers using ASIC or COT flows;
Battery powered applications, consumer electronics
Why is it Better?
Integrated, single tool solution
Superior power savings
Faster runtime
Low Power Synthesis Option
RTL and gate level optimizations
Auto clock gating
Sleep-mode for moles, components
Fully design-constraint driven
Accurate -- RTL transformations based on gate level timing/power
Power analysis
Integrated transparently
Customer Benchmark Data
Significant power savings over conventional flows
Customer 1: 48% power rection
Customer 2: 58% power rection

Better timing, area, and power numbers than competitors
Customer 2: 8.3% better power; 5.6% smaller area; better slack
Customer 3: 14.99% better power; 6x faster runtime; similar area, slack
Proctive Design Plan with Cadence SP&R
Datapath Synthesis Option Quick Reference Card
What is it?
An option to Ambit BuildGates and PKS
Enables faster design, smaller area
Who is the Typical User?
Logic designers using ASIC or COT flows
DSP, multimedia, telecom, networking, processor
Why i it Better?
Integrated, single tool solution
Superior timing and area
Greater Proctivity
Datapath Synthesis Option
Integrated transparently
Automatic partitioning of datapath and control
Automatic Operator Merging
Automatic architecture selection, creation
Enhanced component library
Integrated flow, Outstanding Results: Area, Speed
“ Development of our advanced wireless procts demands high performance synthesis of complex signal processing algorithms. The Ambit BuildGates and its Datapath Option deliver outstanding results in both circuit size and speed, meeting our tough timing requirements. The Datapath option gives the obvious benefit of writing pure RTL versus instantiation of specialized datapath blocks. The significant savings in time and tool expenditures makes the Datapath option very attractive.”

Jim Nelson
Vice president of technology
LinCom Wireless
Upto 50% Area Rection, Streamlined Flow
“ The Cadence Datapath Option has streamlined our design process, and has proced up to 50 percent rection in datapath area. As the instry leader in support for Verilog 2000 in synthesis, Cadence makes the RTL much cleaner, smaller, and more understandable. This feature was integral in the completion of our Fast Fourier Transform (FFT) design with complex multipliers and radix-4 Butterflies.”
Raja Gosula
ASIC Manager
Innocomm Wireless
Proctive Design Plan with Cadence SP&R
PKS Quick Reference Card
What is it?
A physical synthesis tool
Like conventional synthesis with superior timing-correlation and Quality of Results
Who is the Typical User
Logic designers using ASIC or COT flows
Why is it Better?
Superior correlation +/- 3%
Superior QoR & Capacity
Superior integration
PKS: What Problem Does It Solve?
DSM Timing Closure is Unpredictable
Poor correlation between Synthesis and P&R timing
Repair methods are slow to converge

SP&R Test Case 45
Video/graphics
160k instances
70 macros
5 layers, 0.18 micron
Target freq: 100Mhz
Test 45 Slack Summary
Test 45 Slack Summary
SP&R ASIC Vendor Support
SP&R Customer Adoption
SP&R Customer Adoption
Proctive Design Plan with Cadence SP&R
Silicon Ensemble - PKSQuick Reference Card
What is it?
An optimization place & route tool
Like conventional P&R with superior optimizations and Quality of Results

Who is the Typical User
Digital physical designers
Why is it Better?
Superior timing and area
Signal Integrity Prevention, Analysis, and correction
Low-risk proven upgrade
Timing Closure with SE-PKS
Integration of Physical Synthesis Technology
Flow supports conventional or physical synthesis netlist or database hand-off
Preserved traditional flow steps, upgraded engines
No constraint handling issues
On-line SI technology

Clock Distribution
Clock Tree Generation
Supports gated, inverting, non-inverting, and multi-level clock trees
Clock Wire Self Heat Prevention
Inserts buffers to rece the load
Uses wide-wire clock routing
Clock Net Hot Electron Prevention
Slew control through driver upsizing and repeater insertion
Signal Integrity
Crosstalk
Prevention
During placement optimization
Analysis and Correction
Handles both glitch and delay effects.
Post route automatic fixing
Repair Techniques
Buffer Insertion
Most cost-effective in case of congested design
Default method of fixing
Wide Space routing
Best suited for errors in non-congested areas
No penalty of logic verification (formal verification)
Shielded routing
Useful for critical nets such as Clock
Consumes routing resources
Crosstalk Results
69618 components, 43085 nets, 771 I/O pins
0.25um, 5 LM, 1.8V, 5 clocks, Max Freq - 140MHz

Power Analysis
Electromigration Analysis :
Supports comprehensive rail analysis
Clearly identify and flag segments of the rail susceptible to electromigration
Correct ring the power routing phase
Voltage Drop Analysis:
Supports both static and dynamic voltage drop on the power grid
User generated vcd file input
Clearly identify and flag problem segments of the rail
Correct ring the power routing
Power Analysis Results
Business StatisticsSI
Over 40 customers
More than 1000 active licenses worldwide
In use by leading ASIC vendors
Fujitsu, Hitachi, Mitsubishi, Sony, NEC, Toshiba,...
In use by leading semiconctor companies:
Cisco, Conexant, Motorola, Nortel, HP-Agilent, Texas Instruments

SI Library Characterization
Libraries Vendors - Artisan, Nurlogic, Virtual Silicon
Foundries - TSMC 0.18u, 0.15u UMC 0.15u
Other partnerships underway
Library SI cookbook available for In-house library developers
Quality of Results
Routing
Proven technology
Fastest in the instry
High density
Crosstalk repair
Antenna avoidance and repair
Supports ECO
Incremental routing
Capacity
64-bit SE-PKS
Solaris port available in May, HP port in June
Increased capacity for QP, WR, Pearl, HE
Can handle flat designs up to 10M gates
Business StatisticsP&R
Over 400 customers
More than 5000 active licenses worldwide
In use by leading ASIC vendors
Fujitsu, Hitachi, Mitsubishi, Motorola, NEC, Toshiba,...
In use by leading semiconctor companies:
IBM, Intel, Motorola, Philips, ST, Texas Instruments

Proctive Design Plan with Cadence SP&R
Integration EnsembleQuick Reference Card
What is it?
A complete Front to Back, Synthesis Place & Route tool

Who is the Target Customer
Digital logical designers
Digital physical designers

Why is it Better?
Capacity/Hierarchy
Superior timing and area
Signal Integrity Prevention, Analysis, and correction
Major Features
Proctive Design Plan with Cadence SP&R

③ 集成电路版图设计

一般来说 IC fabless公司 如果不做集成电路后端物理设计的话，会把这部分任回务外包给其他公答司做，如提供工艺的foundry。委托给个人的情况较少见，这个涉及到前段设计人员、物理设计人员、工艺厂商三方的合作，而且芯片设计本身是一个反复的过程，不恰当的任务分配，这样会延迟设计周期，增加风险。

④ 【IC版图设计】和【PCB版图设计】的区别~~~~

ic指的是集成电路，版图设计是ic设计步骤里的除去验证的最后步骤。

pcb电路板设计的版对象是宏观电路，即权使用做好的芯片去搭建电路系统。

而ic设计做的是芯片本身，所以这里的版图设计（layout）就是芯片内部的电路物理实现，即使是裸片，肉眼也是看不清线路的，因为实在是太小了。一般layout设计工具用的比较多的是cadence的virtuoso。

如果是pcb的话，工具那就多了去了。

再给你个ic的版图在设计的时候的样子吧~

当然这只是一个芯片的一小部分

⑤ 什么是版图设计规则，集成电路版图设计中为什么要遵守版图设计规则

design rule,设计规则。抄因为你的版图是最终交给晶袭圆厂流片用的，所以你的版图必须符合相关设计规则。不同工艺的设计规则不同，根据工艺要求和分辨率要求，会有不同。常见的有通孔尺寸，多晶最小尺寸，n井到多晶尺寸等。。也就是最小宽度、最小间距、最小覆盖等几种。版图必须经过drc检查，才能认为你的版图和工艺兼容，可以正常流片，否则会因为工艺流片的误差造成期间失效

⑥ 集成电路版图与裸芯片解剖后有什么差异

集成电路版图设计是根据所设计的电路绘制版图，此时考虑的因素很多，包括延时、功耗、上市时间、市场潜力什么的（不过这些在设计电路的时候已经考虑到了）、最终流片。裸芯片解剖就是reverse design 根据别人已经流片设计封装上市的芯片，复原人家的版图，说白了就是盗版。

• 集成电路（integrated circuit）是一种微型电子器件或部件。采用一定的工艺，把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构；其中所有元件在结构上已组成一个整体，使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。它在电路中用字母“IC”表示。集成电路发明者为杰克·基尔比（基于锗（Ge）的集成电路）和罗伯特·诺伊思（基于硅（Si）的集成电路）。当今半导体工业大多数应用的是基于硅的集成电路。

• 是20世纪50年代后期一60年代发展起来的一种新型半导体器件。它是经过氧化、光刻、扩散、外延、蒸铝等半导体制造工艺，把构成具有一定功能的电路所需的半导体、电阻、电容等元件及它们之间的连接导线全部集成在一小块硅片上，然后焊接封装在一个管壳内的电子器件。其封装外壳有圆壳式、扁平式或双列直插式等多种形式。集成电路技术包括芯片制造技术与设计技术，主要体现在加工设备，加工工艺，封装测试，批量生产及设计创新的能力上。

⑦ 集成电路版图gate是什么含义

GATE: 门的意思
IC即集成电路(integrated circuit)是一种微型电子器件或部件。采用一定的工艺，把一个电路中回所需的晶体管、电答阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构;其中所有元件在结构上已组成一个整体，使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。它在电路中用字母"IC"表示

IC上标有GATE的话，说明该芯片是有MOS管的门电路。
在芯片后端设计过程中在晶圆的MOS管栅极用的是Ploy，但是电阻我一般也是给Ploy，栅极上的Ploy就属于GATE，但是其他的Ploy用来连线或做电阻就不属于GATE，GATE说的是MOS管上的控制用的门。

⑧ IC版图设计和PCB版图设计的区别

ic指的是集成电路，版图设计是ic设计步骤里的除去验证的最后步骤。

pcb电路板专设计的对象是属宏观电路，即使用芯片搭建系统。

而ic设计做的是芯片本身，所以这里的版图设计（layout）就是芯片内部的电路物理实现，即使是裸片，肉眼也是看不清线路的，因为实在是太小了。一般layout设计工具用的比较多的是cadence的virtuoso。

如果是pcb的话，工具那就多了去了。

再给你个ic的版图在设计的时候的样子吧~

当然这只是一个芯片的一小部分